Input detection device and electronic device

ABSTRACT

An input detection device is provided with a plurality of drive electrodes, a metal electrode opposed to the plurality of drive electrodes and having a predetermined wiring pattern, and a light-shielding film. In plan view, a width of the wiring pattern of the metal electrode overlapped with a portion of the light-shielding film with a large width is larger than a width of the wiring pattern of the metal electrode overlapped with portions other than the portion of the light-shielding film with the large width.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority from Japanese Patent ApplicationNo. 2016-161400 filed on Aug. 19, 2016, the content of which is herebyincorporated by reference into this application.

TECHNICAL FIELD OF THE INVENTION

The present invention relates to an input detection device and anelectronic device, and particularly, relates to an input detectiondevice and an electronic device having a touch detection functioncapable of detecting proximity of an external object.

BACKGROUND OF THE INVENTION

Recently, as an input detection device, an input detection device havinga touch detection function capable of detecting proximity (hereinafter,including contact) of an external object, so-called a touch panel, hasdrawn attention. The touch panel is mounted on a display device such asa liquid-crystal display device or integrated with a liquid-crystaldisplay device and is provided as a display device with a touchdetection function.

There is a touch panel which enables use of a pen, for example, as theexternal object. By using the pen, for example, a small region can bedesignated, and handwritten characters can be input. There are varioustechniques for detecting touch by the pen. One of the various techniquesis an electromagnetic induction method. In the electromagnetic inductionmethod, since it is possible to realize high accuracy and highpen-pressure detection accuracy and to also realize a hovering detectionfunction of detecting a hovering state in which the external object isspaced apart from the front surface of the touch panel, theelectromagnetic induction method is an effective technique as atechnique to detect touch by the pen.

Also, there is a touch detection device capable of detecting a finger orthe like as the external object. In this case, since the detectiontarget is different from the pen, a method different from theelectromagnetic induction method is employed as a technique to detecttouch. For example, there is a method in which an optical change, aresistance value change, or an electric field change generated by touchof a finger or the like is detected. Among these methods, the method ofdetecting an electric field change includes, for example, a capacitivesensing method using an electrostatic capacitance, for example. Sincethe capacitive sensing method has a comparatively simple structure andlow power consumption, it is used in PDA (personal digital assistance),etc.

A technique related to a touch panel of the electromagnetic inductionmethod is described in Japanese Patent Application Laid-Open PublicationNo. H10-49301 (Patent Document 1), for example.

SUMMARY OF THE INVENTION

In a case of the touch panel of the electromagnetic induction method, inorder to reduce a resistance value of a drive electrode and increase acurrent amount, it is effective to arrange a metal electrode opposed tothe drive electrode. The reason is that reduction in resistance isrequired for the touch panel of the electromagnetic induction methodrather than that of the capacitive sensing method.

In this case, a region in which the metal electrode is arranged islimited to an inner side of a light-shielding film. In view of this, thepresent inventors have studied arrangement of the metal electrodecapable of reducing resistance of the drive electrode, in considerationof arrangement relation of the metal electrode and the light-shieldingfilm.

Patent Document 1 describes a technique related to a touch panel of theelectromagnetic induction method, but neither describes nor recognizesresistance reduction of the drive electrode by the arrangement relationbetween the metal electrode and the light-shielding film.

It is an object of the present invention to provide an input detectiondevice capable of reducing resistance of the drive electrode by thearrangement relation between the metal electrode and the light-shieldingfilm.

An input detection device according to one aspect of the presentinvention includes: a plurality of drive electrodes; a metal electrodeopposed to the plurality of drive electrodes and having a predeterminedwiring pattern; and a light-shielding film. In this input detectiondevice, in plan view, a width of the wiring pattern of the metalelectrode overlapped with a portion of the light-shielding film with alarge width is larger than a width of the wiring pattern of the metalelectrode overlapped with portions other than the portion of thelight-shielding film with the large width.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a plan view schematically illustrating a configuration of adisplay device;

FIG. 1B is a cross-sectional view schematically illustrating theconfiguration of the display device;

FIG. 2A is an explanatory view illustrating a principle of a magneticfield detection;

FIG. 2B is an explanatory view illustrating the principle of themagnetic field detection;

FIG. 2C is an explanatory view illustrating the principle of themagnetic field detection;

FIG. 3A is an explanatory view illustrating a principle of an electricfield detection;

FIG. 3B is an explanatory view illustrating the principle of theelectric field detection;

FIG. 3C is a graph illustrating the principle of the electric fielddetection;

FIG. 4 is a block diagram illustrating a configuration of a displaydevice according to a first embodiment;

FIG. 5 is a plan view illustrating a configuration of a module accordingto the first embodiment;

FIG. 6 is a circuit diagram illustrating a pixel array of a displayregion according to the first embodiment;

FIG. 7 is a plan view illustrating arrangement relation between a metalelectrode opposed to a drive electrode and a light-shielding filmaccording to the first embodiment;

FIG. 8 is a cross-sectional view taken along a section line A-B of FIG.7;

FIG. 9 is a plan view illustrating arrangement relation between a metalelectrode opposed to a drive electrode and a light-shielding filmaccording to a comparative example of the first embodiment;

FIG. 10 is an explanatory plan view illustrating operation during amagnetic field generation period of a display device according to asecond embodiment;

FIG. 11 is an explanatory view illustrating a problem of the displaydevice according to the second embodiment;

FIG. 12 is an explanatory view illustrating the problem of the displaydevice according to the second embodiment;

FIG. 13 is a characteristic diagram illustrating values of currentsflowing through drive electrodes in each magnetic field generationperiod of FIG. 11 and FIG. 12;

FIG. 14 is an explanatory diagram illustrating widths of metalelectrodes opposed to far-end, intermediate, and near-end driveelectrodes of the display device according to the second embodiment;

FIG. 15 is a perspective view illustrating an electronic deviceaccording to the first and the second embodiments; and

FIG. 16 is a plan view illustrating another example of the arrangementrelation between the metal electrode opposed to the drive electrode andthe light-shielding film according to the first embodiment.

DESCRIPTIONS OF THE PREFERRED EMBODIMENTS

Hereinafter, embodiments of the present invention will be described indetail with reference to the accompanying drawings. Note that thisdisclosure is an example only and suitable modifications which can beeasily conceived by those skilled in the art without departing from thegist of the present invention are included within the scope of theinvention as a matter of course. In addition, in order to furtherclarify the description, a width, a thickness, a shape, and the like ofrespective portions may be more schematically illustrated in thedrawings than those in an actual state, but they are examples only anddo not limit the interpretation of the present invention.

In addition, in this specification and the respective drawings, the samecomponents described in the drawings which have been described beforeare denoted by the same reference characters, and detailed descriptionthereof may be omitted as needed. In the following description, aliquid-crystal display device with a touch detection function will bedescribed as an example of an input detection device, but the inputdetection device is not limited thereto. For example, the inputdetection device may be an OLED display device with a touch detectionfunction or may be a touch panel or the like not having a displayfunction.

First Embodiment

In a first embodiment, a liquid-crystal display device with a touchdetection function (hereinafter, also referred to as a display device)capable of detecting both touch by a pen and touch by a finger isprovided. First, a basic configuration of the display device will bedescribed. Next, based on the basic configuration, principles ofmagnetic field detection of detecting touch by a pen (hereinafter, alsoreferred to as magnetic field touch detection or magnetic field touchdetection by an electromagnetic induction method) and electric fielddetection of detecting touch by a finger (hereinafter, also referred toas electric field touch detection or electric field touch detection byan capacitive sensing method) will be described.

<Basic Configuration of Display Device>

FIG. 1A is a plan view schematically illustrating a configuration of adisplay device. FIG. 1B is a cross-sectional view schematicallyillustrating the configuration of the display device. In FIGS. 1A and1B, reference numeral 1 denotes a display device, FIG. 1A is a plan viewillustrating a plane of the display device 1, and FIG. 1B is across-sectional view illustrating a cross section of the display device1. The display device 1 is provided with a TFT (Thin Film Transistor)glass substrate (hereinafter, also referred to as an insulating firstsubstrate or, simply, a first substrate) TGB, a layer layered over thefirst substrate TGB, a color filter CFT, a CF (Color Filter) glasssubstrate (hereinafter, also referred to as an insulating secondsubstrate or, simply, a second substrate) CGB, and a layer layered overthe second substrate CGB.

In FIG. 1A, reference characters TL(0) to TL(p) denote drive electrodesconstituted by the layer formed over a first main surface TSF1 of thefirst substrate TGB. Reference characters “RL(0)” to “RL(p)” denotedetection electrodes constituted by the layer formed over a first mainsurface CSF1 of the second substrate CGB. In order to facilitateunderstanding, in FIG. 1A, the first substrate TGB and the secondsubstrate CGB are illustrated in a manner that the substrates areseparated from each other. However, in practice, as illustrated in FIG.1B, the first substrate TGB and the second substrate CGB are arranged insuch a way that the first main surface TSF1 of the first substrate TGBand a second main surface CSF2 of the second substrate CGB are opposedto each other across a liquid crystal layer.

The plurality of layers, the liquid crystal layer, and the like areinterposed between the first main surface TSF1 of the first substrateTGB and the second main surface CSF2 of the second substrate CGB.However, FIG. 1B illustrates only the drive electrodes TL(0) to TL(n+2)interposed between the first main surface TSF1 and the second mainsurface CSF2, the liquid crystal layer, and the color filter CFT. Inaddition, the plurality of detection electrodes RL(0) to RL(p) and apolarizer are arranged over the first main surface CSF1 of the secondsubstrate CGB as illustrated in FIG. 1A. Moreover, in FIG. 1B, referencenumeral 13 denotes a unit detection circuit connected to the detectionelectrode RL(n).

In the present specification, a description will be given assuming that,as illustrated in FIG. 1B, a state of the display device 1 viewed from aside of the first main surface CSF1 of the second substrate CGB and thefirst main surface TSF1 of the first substrate TGB is a plan view. Whenviewed in plan view from the side of the first main surface CSF1 and thefirst main surface TSF1, the drive electrodes TL(0) to TL(p) extend in arow direction (lateral direction) and are arranged in parallel to eachother in a column direction (longitudinal direction) on the first mainsurface TSF1 of the first substrate TGB as illustrated in FIG. 1A. Inaddition, the detection electrodes RL(0) to RL(p) extend in the columndirection (longitudinal direction) and are arranged in parallel to eachother in the row direction (lateral direction) on the first main surfaceCSF 1 of the second substrate CGB as illustrated in FIG. 1A.

The second substrate CGB, the liquid crystal layer, and the like areinterposed between the drive electrodes TL(0) to TL(p) and the detectionelectrodes RL(0) to RL(p). Therefore, the drive electrodes TL(0) toTL(p) and the detection electrodes RL(0) to RL(p) intersect with eachother in plan view, but are electrically separated from each other.There is a capacitance between the drive electrode and the detectionelectrode. In FIG. 1B, the capacitance is illustrated as a capacitiveelement by dashed lines.

It is preferable that the drive electrodes TL(0) to TL(p) and thedetection electrodes RL(0) to RL(p) are orthogonal to each other in planview; however, in plan view, the drive electrodes and the detectionelectrodes may intersect with each other at an angle other than theright angle. Therefore, “orthogonal” used in the description belowshould be construed to also include “intersection.”

<Principle of Magnetic Field Detection>

FIG. 2A is an explanatory view illustrating a principle of a magneticfield detection. FIG. 2B is an explanatory view illustrating theprinciple of the magnetic field detection. FIG. 2C is an explanatoryview illustrating the principle of the magnetic field detection. Aperiod of magnetic field detection is configured of a magnetic fieldgeneration period in which a magnetic field is generated and a magneticfield detection period in which the magnetic field is detected. FIGS. 2Aand 2C each illustrate an operation in the magnetic field generationperiod, and FIG. 2B illustrates an operation in the magnetic fielddetection period. For the sake of convenience of description, FIGS. 2Ato 2C each illustrate a state in which FIG. 1A is rotated by 90 degrees.

During the magnetic field generation period, ends of predetermined driveelectrodes among the drive electrodes TL(0) to TL(p) are electricallyconnected, and a predetermined voltage (for example, a ground voltageVs) and a magnetic field drive signal are supplied to the driveelectrodes whose ends are connected. For example, among one end and theother end of each of the drive electrodes TL(0) and TL(2) illustrated inFIG. 1A, the other end of each of the drive electrodes TL(0) and TL(2)on the right side in FIG. 1A is electrically connected. Thus, the driveelectrodes TL(0) and TL(2) arranged in parallel to each other areconnected in series. The ground voltage Vs is supplied to the one end ofthe drive electrode TL(0) on the left side in FIG. 1A, and the magneticfield drive signal is supplied to the one end of the drive electrodeTL(2) on the left side in FIG. 1A. Here, the magnetic field drive signalis a signal whose voltage periodically changes. The drive electrodesTL(0) and TL(2) constitute a magnetic field generation coil where aregion interposed (a region formed) by the drive electrodes is locatedinside the coil. The magnetic field generation coil generates a magneticfield corresponding to a change in voltage of the magnetic field drivesignal inside the coil.

In FIG. 2A, reference character GX(n−1) denotes the magnetic fieldgeneration coil constituted by the drive electrodes TL(0) and TL(2).Similarly to the magnetic field generation coil GX(n−1), referencecharacters GX(n) to GX(n+4) denote magnetic field generation coilsconstituted by the drive electrodes TL(1) and TL(3) to TL(p).

In FIG. 2A, reference characters C and L1 denote a capacitive elementand a coil incorporated in a pen Pen, respectively. The capacitiveelement C and the coil L1 are connected in parallel such that thecapacitive element and the coil constitute a resonance circuit. In themagnetic field generation period, the ground voltage Vs is supplied toone end of each of the magnetic field generation coils GX(n−1) toGX(n+3). A magnetic field drive signal CLK is supplied to the other endof the magnetic field generation coil GX(n). Therefore, the magneticfield generation coil GX(n) generates a magnetic field φ1 correspondingto a change in voltage of the magnetic field drive signal CLK. When thepen Pen is in proximity to the magnetic field generation coil GX(n), themagnetic field generation coil GX(n) and the coil L1 areelectromagnetically coupled, the magnetic field φ1 causes an inducedvoltage due to mutual induction to be generated in the coil L1, and thecapacitive element C is charged.

Next, the magnetic field generation period transitions to the magneticfield detection period illustrated in FIG. 2B. In the magnetic fielddetection period, a magnetic field is detected by using the detectionelectrodes RL(0) to RL(p). Each of the detection electrodes RL(0) toRL(p) includes a pair of ends. Among one ends and the other ends of thedetection electrodes RL(0) to RL(p), the other ends of predetermineddetection electrodes are electrically connected to each other. Forexample, the other ends of the detection electrodes RL(0) and RL(3)illustrated in FIG. 1A are electrically connected to each other on theupper side in FIG. 1A. Therefore, the detection electrodes RL(0) andRL(3) arranged in parallel to each other are connected in series. In themagnetic field detection period, a predetermined voltage Vs is suppliedto the one end of the detection electrode RL(3), and the one end of thedetection electrode RL(0) is connected to the unit detection circuit.Thus, a magnetic field detection coil is formed, and a region interposed(a region formed) by the detection electrodes RL(0) and RL(3) is locatedinside the coil. The magnetic field detection coil detects a magneticfield generated by the pen Pen.

In FIG. 2B, reference character DY(n−2) denotes a magnetic fielddetection coil constituted by the detection electrodes RL(0) and RL(3).Similarly, reference characters DY(n−1) to DY(n+1) denote magnetic fielddetection coils constituted by the detection electrodes RL(2) to RL(p).In the magnetic field detection period, the predetermined voltage Vs issupplied to one end of each of the magnetic field detection coilsDY(n−2) to DY(n+1). Signals Rx(n−2) to Rx(n+1) from the respective otherends of the magnetic field detection coils DY(n−2) to DY(n+1) aresupplied to the unit detection circuits.

If the capacitive element C is charged in the magnetic field generationperiod, the coil L1 generates a magnetic field φ2 which changesaccording to a resonance frequency of the resonance circuit depending onelectric charges charged in the capacitive element C in the magneticfield detection period. In FIG. 2B, the center (alternate long and shortdash line) of the coil L1 is present inside the magnetic field detectioncoil DY(n). Therefore, the magnetic field detection coil DY(n) and thecoil L1 are electromagnetically coupled to each other, and an inducedvoltage is generated in the magnetic field detection coil DY(n) due tomutual induction. As a result, the signal Rx(n) from the other end ofthe magnetic field detection coil DY(n) changes according to a chargequantity charged in the capacitive element C. The unit detection circuitconnected to the magnetic field detection coil DY(n) outputs the changein the signal Rx(n) as a detection signal. Accordingly, it is possibleto detect whether the pen Pen is in proximity (touches) and to extractthe coordinates of the pen. In addition, since the detection signalchanges according to the charge quantity, it is possible to determine adistance to the pen Pen.

FIG. 2C illustrates the magnetic field generation period subsequent tothe state illustrated in FIG. 2B. FIG. 2C is different from FIG. 2A inthat the magnetic field drive signal CLK is supplied to the magneticfield generation coil GX(n+1). Since the position of the pen Pen is notchanged, in the magnetic field generation period illustrated in FIG. 2C,an induced voltage is not generated in the coil L1, and the capacitiveelement C is not charged. Therefore, in the magnetic field detectionperiod subsequent to the state illustrated in FIG. 2C, proximity of thepen Pen is not detected. Subsequently, in a similar manner, detection ofthe pen Pen is performed.

<Principles of Electric Field Detection>

FIG. 3A is an explanatory view illustrating a principle of an electricfield detection. FIG. 3B is an explanatory view illustrating theprinciple of the electric field detection. FIG. 3C is a graphillustrating the principle of the electric field detection. In FIG. 3A,each of reference characters 12-0 to 12-p denotes a unit drive circuitoutputting an electric field drive signal, and each of referencecharacters 13-0 to 13-p denotes the unit detection circuit. In addition,in FIG. 3A, a pulse signal encircled by a solid line represents awaveform of an electric field drive signal Tx(2) supplied to the driveelectrode TL(2). Reference character FG denotes a finger as an externalobject.

When the electric field drive signal Tx(2) is supplied to the driveelectrode TL(2), an electric field is generated between the driveelectrode TL(2) and the detection electrode RL(n) orthogonal to thedrive electrode TL(2) as illustrated in FIG. 3B. At this time, when thefinger FG touches the vicinity of the drive electrode TL(2), an electricfield is also generated between the finger FG and the drive electrodeTL(2), and the electric field generated between the drive electrodeTL(2) and the detection electrode RL(n) reduces. Accordingly, a chargequantity between the drive electrode TL(2) and the detection electrodeRL(n) reduces. As a result, as illustrated in FIG. 3C, the chargequantity generated in response to supply of the drive signal Tx(2) whenthe finger FG touches the vicinity is smaller by ΔQ than that when thefinger FG does not touch the vicinity. The difference in charge quantityleads to a difference in voltage, and the difference in voltage issupplied to the unit detection circuit 13-n and is output as a detectionsignal.

Similarly, by supplying an electric field drive signal to each of theother drive electrodes, a change in voltage of the signal depending onwhether or not the finger FG touches the vicinity of the drive electrodeis generated in one of the detection electrodes RL(0) to RL(p), and thechange in voltage is output as a detection signal. Thus, it is possibleto detect whether or not the finger FG touches and to extract thecoordinates of the finger.

As described above, in magnetic field detection, a magnetic field drivesignal is supplied to a drive electrode selected from among the driveelectrodes TL(0) to TL(p), and in electric field detection, an electricfield drive signal is supplied to the selected drive electrode.Meanwhile, in displaying, a display drive signal is supplied to each ofthe drive electrodes TL(0) to TL(p). Since the display drive signalcauses the drive electrodes TL(0) to TL(p) to have the same voltage, thedrive electrodes TL(0) to TL(p) can be considered as one commonelectrode.

<Overall Configuration of Display Device>

FIG. 4 is a block diagram illustrating a configuration of a displaydevice according to a first embodiment. In FIG. 4, the display device 1includes a display panel (liquid crystal panel), a control device 3, agate driver 4 (gate drivers 4L and 4R), and a touch control device 5. Inaddition, the display device 1 further includes drive circuits DRVL andDRVR and a detection circuit DET. The display panel includes a displayregion where display is performed, and a frame region in the peripheryof the display region. In terms of display, the display region is anactive region, and the frame region surrounding the display region is anon-active region. In FIG. 4, reference numeral 2 denotes the displayregion. In addition, the display region 2 is a detection region ofmagnetic field touch detection by the electromagnetic induction methodand of electric field touch detection by the capacitive sensing method.

The display region 2 includes a pixel array where a plurality of pixelsare arranged in a matrix. In the pixel array, a plurality of signallines, the plurality of drive electrodes, a plurality of scan lines, andthe plurality of detection electrodes are arranged. With reference toFIG. 4, in the pixel array, the signal lines SL(0) to SL(p) extend inthe longitudinal direction (column direction) and are arranged inparallel to one another in the lateral direction (row direction). Inaddition, the drive electrodes TL(0) to TL(p) extend in the lateraldirection and are arranged in parallel to one another in thelongitudinal direction. Further, the scan lines extend in the lateraldirection and are arranged in parallel to one another in thelongitudinal direction. The detection electrodes RL(0) to RL(p) extendin the longitudinal direction and are arranged in parallel to oneanother in the lateral direction. In this case, the pixels are arrangedin spaces formed by the plurality of signal lines and the plurality ofscan lines intersecting with each other. In a period for display(display period), a pixel is selected by the signal line and the scanline, a voltage of the signal line and a voltage of the drive electrodeat this time are applied to the selected pixel, and display according tothe difference in voltage between the signal line and the driveelectrode is performed.

The control device 3 receives a timing signal supplied to an externalterminal Tt and image information supplied to an input terminal Ti,generates an image signal according to the image information in thedisplay period, and supplies the image signal to the plurality of signallines SL(0) to SL(p). In addition, the control device 3 receives thetiming signal supplied to the external terminal Tt and a control signalSW supplied from the touch control device 5, and generates varioussignals. In FIG. 4, only signals necessary for the description aredepicted as representatives among the signals generated by the controldevice 3. That is, the control device 3 generates a synchronizationsignal TSHD and control signals CNTL and CNTR. Although there is noparticular limitation, the control device 3 generates drive signals TPLand TSV (that is, the control device 3 functions as a supply source).

The synchronization signal TSHD is a synchronization signal fordiscriminating the display period in which display is performed in thedisplay region 2 and a touch detection period in which touch detectionis performed in the display region 2. The control device 3 controls suchthat the touch control device 5 operates in the touch detection periodby the synchronization signal TSHD.

In displaying, the gate driver 4 generates scan line signals Vs0 to Vspaccording to a timing signal from the control device 3 and supplies thescan line signals Vs0 to Vsp to the scan lines in the display region 2.In the display period, pixels connected to a scan line to which ahigh-level scan line signal is supplied are selected, and the selectedpixels perform display according to image signals supplied to the signallines SL(0) to SL(p) at this time.

In magnetic field touch detection by the electromagnetic inductionmethod or electric field touch detection by the capacitive sensingmethod, the detection circuit DET detects changes in signal in thedetection electrodes RL(0) to RL(p) and outputs detection signals Rx(0)to Rx(p).

The touch control device 5 receives the detection signals Rx(0) toRx(p), extracts the coordinates of the touched location, and outputs thecoordinates from an external terminal To. In addition, the touch controldevice 5 outputs the control signal SW, and the touch control device 5receives the synchronization signal TSHD and operates in synchronizationwith the control device 3.

The display region 2 has sides 2-U and 2-D parallel to the row of thepixel array, and sides 2-R and 2-L parallel to the column of the pixelarray. Here, the side 2-U and the side 2-D face each other, and theplurality of drive electrodes TL(0) to TL(p) and the plurality of scanlines in the pixel array are arranged between the two sides. Inaddition, the side 2-R and the side 2-L face each other, and theplurality of signal lines SL(0) to SL(p) and the plurality of detectionelectrodes RL(0) to RL(p) in the pixel array are arranged between thetwo sides.

The drive circuit DRVL is arranged along the side 2-L of the displayregion 2 and is connected to the one end of each of the drive electrodesTL(0) to TL(p). Similarly, the drive circuit DRVR is arranged along theside 2-R of the display region 2 and is connected to the other end ofeach of the drive electrodes TL(0) to TL(p).

In magnetic field touch detection, the drive circuits DRVL and DRVR eachselect a desired drive electrode from among the drive electrodes TL(0)to TL(p) and supply a magnetic field drive signal to the selected driveelectrode. Also in electric field touch detection, the drive circuitsDRVL and DRVR select a desired drive electrode and supply an electricfield drive signal to the selected drive electrode.

In FIG. 4, reference characters TPLL, TPLR, TSVL, and TSVR each denote asignal wire. The signal wires TPLL and TSVL extend along the side 2-L ofthe display region 2. Similarly, the signal wires TPLR and TSVR extendalong the side 2-R of the display region 2.

In the magnetic field touch detection and the electric field touchdetection, the drive circuit DRVL connects the selected drive electrodeto the signal wire TPLL or TSVL. Similarly, in the magnetic field touchdetection and the electric field touch detection, the drive circuit DRVRconnects the selected drive electrode to the signal wires TPLR or TSVR.

The drive signals TPL and TSV generated by the control device 3 aresupplied to ends of the signal wires TPLL and TPLR and the signal wiresTSVL and TSVR, respectively. In the magnetic field touch detection, thedrive signals TPL and TSV propagating through the signal wires TPLL andTPLR, and the signal wires TSVL and TSVR, respectively, are supplied tothe selected drive electrode, and a magnetic field is generated. Also,in the electric field touch detection, the drive signals TPL and TSVpropagating through the signal wires TPLL and TPLR, and the signal wiresTSVL and TSVR, respectively, are supplied to the selected driveelectrode, and an electric field is generated.

<Module Configuration of Display Device>

FIG. 5 is a schematic plan view illustrating an overall configuration ofa module 500 mounted with the display device 1 according to the firstembodiment. FIG. 5 schematically depicts the actual arrangement. In FIG.5, reference numeral 501 denotes a region of the first substrate TGBillustrated in FIGS. 1A and 1B, and reference numeral 502 denotes aregion where the first substrate TGB and the second substrate CGB arelayered. In the module 500, the first substrate TGB in the region 501and the first substrate TGB in the region 502 are integrated. Inaddition, in the region 502, the second substrate CGB is mounted overthe first substrate TGB such that the first main surface TSF1 of thefirst substrate TGB faces the second main surface CSF2 of the secondsubstrate CGB. In addition, in FIG. 5, reference characters 500-U and500-D denote short sides of the module 500, and reference characters500-L and 500-R denote long sides of the module 500.

The gate driver 4L and the drive circuit DRVL illustrated in FIG. 4 arearranged in a left side frame region between the side 2-L of the displayregion 2 and the side 500-L of the module 500, in the region 502. Thegate driver 4R and the drive circuit DRVR illustrated in FIG. 4 arearranged in a right side frame region between the side 2-R of thedisplay region 2 and the side 500-R of the module 500. The detectioncircuit DET and the control device 3 illustrated in FIG. 4 are arrangedin a lower side frame region between the side 2-D of the display region2 and the side 500-D of the module 500. The detection circuit DET isconstituted by a wire and a component formed on the first main surfaceTSF1 of the first substrate TGB in the region 501. The control device 3is mounted on the first substrate TGB such that the control device 3covers the detection circuit DET in plan view. In addition, wires andcomponents constituting the drive circuits DRVL and DRVR are also formedon the first main surface TSF1 of the first substrate TGB, in the region502.

The detection signals Rx(0) to Rx(p) described with reference to FIG. 4are supplied to the touch control device 5 via a wire in a flexiblecable FB1. A flexible cable FB2 is connected to the region 501. Thetouch control device 5 transmits and receives a signal to and from thecontrol device 3 via a connector CN provided at the flexible cable FB2.

As described above, the display region 2 includes the pixel array wherethe plurality of pixels are arrayed in a matrix. The display region 2includes the plurality of drive electrodes TL(0) to TL(p) and theplurality of scan lines arranged along the row of the pixel array, andthe plurality of signal lines SL(0) to SL(p) and the plurality ofdetection electrodes RL(0) to RL(p) arranged along the column of thearray. FIG. 5 illustrates two drive electrodes TL(n) and TL(m), twosignal lines SL(k) and SL(n), and three detection electrodes RL(n−2) toRL(n) by way of example. Note that the scan lines are omitted in FIG. 5;however, the scan lines extend in parallel to the drive electrodes TL(n)and TL(m) illustrated as examples.

In addition, in FIG. 5, the pixel array is depicted by a dashed linePDM. Reference character Pix denotes each of the pixels arranged at fourcorners of the display region 2 and the pixels arranged at theintersections of the drive electrodes and the signal lines illustratedas examples among the plurality of pixels arranged in the pixel arrayPDM.

<Pixel Array of Display Region>

FIG. 6 is a circuit diagram illustrating a pixel array of the displayregion according to the first embodiment. As illustrated in FIG. 6, thedisplay region 2 has the pixel array in which the plurality of pixelsPix are disposed in a matrix (row-column configuration). Each of thepixels Pix corresponds to one set of pixels including three sub-pixelsSPix, for example, red, green, and blue. In the pixel array, theplurality of signal lines, the plurality of scan lines, and theplurality of drive electrodes are disposed. The sub-pixels SPix aredisposed in the spaces which are formed by intersections with theplurality of signal lines and the plurality of scan lines.

In FIG. 6, as examples, part of a plurality of signal lines SL(k) toSL(k+3), a plurality of scan lines GL(m) to GL(m+3), and a plurality ofdrive electrodes TL(n) to TL(n+2) is illustrated. The plurality ofsignal lines SL(k) to SL(k+3) extend in the column direction and aredisposed in parallel in the row direction. The plurality of scan linesGL(m) to GL(m+3) extend in the row direction and are disposed inparallel in the column direction. The plurality of drive electrodesTL(n) to TL(n+2) extend in the row direction and are disposed inparallel in the column direction. The sub-pixels SPix are disposed inthe spaces which are formed by intersections of the plurality of signallines SL(k) to SL(k+3) and the plurality of scan lines GL(m) to GL(m+3).

The sub-pixel SPix is provided with a thin-film transistor (TFT; ThinFilm Transistor) element Tr, a liquid crystal element LC, and aretention capacity C. The TFT element Tr is formed of a thin-filmtransistor and, in this example, is formed of an n-channel MOS MetalOxide Semiconductor)-type TFT. Sources of the TFT elements Tr areconnected to the signal lines SL(k) to SL(k+3), gates thereof areconnected to the scan lines GL(m) to GL(m+3), and drains thereof areconnected to first ends of the liquid crystal elements LC. The firstends of the liquid crystal elements LC are connected to the drains ofthe TFT elements Tr, and second ends thereof are connected to the driveelectrodes TL(n) to TL(n+2). First ends of the retention capacities Care connected to the drains of the TFT elements Tr, and second endsthereof are connected to the drive electrodes TL(n) to TL(n+2).

In the display device 1 according to the first embodiment, the gatedriver 4 illustrated in FIG. 4 is driven so as to sequentially scan thescan lines GL(m) to GL(m+3), thereby sequentially selecting a singlehorizontal line (a single line of the pixels Pix disposed in thematrix). Also, in the display device 1, the control device 3 illustratedin FIG. 4 supplies the image signals to the pixels Pix, which belong tothe single horizontal line, via the signal lines SL(k) to SL(k+3),thereby displaying the single horizontal line one by one. When thisdisplay operation is carried out, the drive circuits DRVL and DRVRillustrated in FIG. 4 are configured to apply the drive signals to thedrive electrodes TL(n) to TL(n+2) corresponding to the respective singlehorizontal lines.

In the display region 2 of the display device 1, in plan view, asillustrated in FIG. 6, the plurality of signal lines SL(k) to SL(k+3)and the plurality of scan lines GL(m) to GL(m+3) are disposed in theregions overlapped with a light-shielding film BM. Also, in the displayregion 2, the regions in which the light-shielding film BM is notdisposed serve as openings OP. The light-shielding film BM is disposedin the boundaries of the sub-pixels SPix and therefore, has a latticeshape. The openings OP are the openings which are formed in the latticeshape of the light-shielding film BM and are disposed to correspond tothe sub-pixels SPix. The opening of the red sub-pixel SPix is denoted byreference character OP(R), the opening of the green sub-pixel SPix isdenoted by reference character OP(G), and the opening of the bluesub-pixel SPix is denoted by reference character OP(B).

<Arrangement Relation between Metal Electrode Opposed to Drive Electrodeand Light-Shielding Film>

FIGS. 7 to 9 and FIG. 16 are views for describing arrangement relationbetween a metal electrode opposed to a drive electrode and alight-shielding film. Among these, FIG. 7, FIG. 8, and FIG. 16 are viewsdescribing the first embodiment, and FIG. 9 is a view describing thecomparative example for the first embodiment.

In a case of a touch panel of the electromagnetic induction method likethe display device 1 according to the first embodiment, in order toreduce the resistance value of the drive electrode and increase acurrent amount, it is effective to dispose a metal electrode opposed tothe drive electrode. It is for a reason that the touch panel of theelectromagnetic induction method requires resistance reduction more thana touch panel of the capacitive sensing method.

In this case, the region in which the metal electrode is disposed islimited to an inner side of the light-shielding film. Therefore, thefirst embodiment provides the display device having an input detectiondevice which reduces the resistance of the drive electrode by thearrangement relation between the metal electrode and the light-shieldingfilm.

First, in order to facilitate understanding of the characteristics ofthe arrangement relation between the metal electrode opposed to thedrive electrode and the light-shielding film according to the firstembodiment, the comparative example for the first embodiment will bedescribed. FIG. 9 is a plan view illustrating the arrangement relationbetween a metal electrode opposed to drive electrodes and alight-shielding film according to the comparative example for the firstembodiment. FIG. 9 is illustrated in plan view and illustrates part offour pixel arrays of a red pixel, a green pixel, a blue pixel, and a redpixel.

In the display device 1, there is a method in which a metal electrode MLis disposed to be opposed to the drive electrodes in order to reduce theresistance of the drive electrodes TL(0) to TL(p). In that case, inorder to suppress reflection caused by a wiring layer of the metalelectrode ML, the metal electrode ML has to be disposed so as to beincluded in the light-shielding film BM. In the example of FIG. 9, themetal electrode ML is formed in a linear shape along the scan lineGL(m). More specifically, in the pixel array of the red pixels, greenpixels, and blue pixels, the metal electrode ML is formed to have awidth L31 having an equal width along the scan line GL(m). In this case,the light-shielding film BM with which the metal electrode ML isoverlapped is formed along the scan line GL by a width L21, which islarger than that of the metal electrode ML.

In the comparative example for the first embodiment illustrated in FIG.9, since the region in which the metal electrode ML is disposed islimited to the inner side of the light-shielding film BM, inconsideration of the arrangement relation between the metal electrode MLand the light-shielding film BM, resistance reduction of the driveelectrode TL is further required.

Therefore, in the first embodiment, arrangements as illustrated in FIG.7 and FIG. 8 are made. FIG. 7 is a plan view illustrating thearrangement relation between a metal electrode opposed to the driveelectrodes and the light-shielding film according to the firstembodiment. FIG. 7 is illustrated in plan view and illustrates part offour pixel arrays of a red pixel, a green pixel, a blue pixel, and a redpixel. FIG. 8 is a cross-sectional view by a section line A-B of FIG. 7.

In FIG. 7 and FIG. 8, reference characters SL(k) to SL(k+3) denote thesignal lines, reference characters GL(m) to GL(m+1) denote the scanlines, and reference character TL(n) denotes the drive electrode. Anopening of the drive electrode TL(n) is denoted by reference characterTLO. Also, reference character BM denotes the light-shielding film, andthe openings of the light-shielding film BM are denoted by referencecharacters OP(R), OP(G), and OP(B). Reference characters (R), (G), and(B) of the openings OP correspond to the red pixel, the green pixel, andthe blue pixel, respectively. Also, reference character ML denotes themetal electrode, reference character SP denotes a spacer, and referencecharacters PL(R), PL(G), and PL(B) denote pixel electrodes,respectively. Reference characters (R), (G), and (B) of the pixelelectrodes PL correspond to the red pixel, the green pixel, and the bluepixel, respectively. Also, reference characters CN1 to CN3 denotecontacts, reference character CNW denotes a contact wire, and referencecharacters IS1 to IS3 denote insulating layers, respectively. Thecontact CN1, the contact CN2, and the contact CN3 are the contactsthrough openings of the insulating layer IS1, the insulating layer IS2,and the insulating layer IS3, respectively, and the contacts CN2 and CN3use the contact wire CNW as a bottom base.

As illustrated in FIG. 7 and FIG. 8, the display device 1 according tothe first embodiment is provided with the first substrate (TFTsubstrate) TGB, the second substrate (CF substrate) CGB disposed to beopposed to the first substrate TGB, and the liquid crystal layer LCLsandwiched between the first substrate TGB and the second substrate CGB(as these substrates, glass substrates are adopted in the presentembodiment, resin substrates may be applicable). A backlight (notillustrated) is disposed on a back surface of the first substrate TGB.

The second substrate CGB includes a glass substrate GBC and a colorfilter CFT formed over one surface of the glass substrate GBC. The colorfilter CFT has the light-shielding film BM having the lattice shape andthe openings OP(R), OP(G), and OP(B). The light-shielding film BM isformed of a material having a high light absorption rate. In the colorfilter CFT, color regions colored by three colors, i.e., red, green, andblue are periodically arrayed in the openings OP(R), OP(G), and OP(B)and are associated with the pixels Pix using the three sub-pixels SPixillustrated in FIG. 6 as one set.

The first substrate TGB includes a glass substrate GBT, the plurality ofpixel electrodes PL(R), PL(G), and PL(B) disposed in the lattice shapeon the glass substrate GBT, the drive electrode TL(n), and theinsulating layer IS3. On the drive electrode TL(n), the metal electrodeML is formed to be opposed thereto. The drive electrode TL(n) is formedof a transparent conductive material such as indium tin oxide (ITO). Themetal electrode ML is formed of a metal material having a higherconductivity than that of the drive electrode TL(n), for example, ametal such as Ti (titanium) or AL (aluminum).

Wires of the signal lines which supply the pixel signals to the pixelelectrodes PL(R), PL(G), and PL(B), the scan lines which drive the TFTelements, etc. are formed in the first substrate TGB in a layeredmanner. FIG. 8 illustrates the scan line GL(m). The pixel electrodesPL(R), PL(G), and PL(B) are connected to the contact wire CNW throughthe contacts CN3 and CN2 and are further connected to the signal linesthrough the contact CN1. The insulating layers IS1 and IS2 are formedbetween the TFT elements, the signal lines, and the scan lines excludingportions connected by the contacts CN1 and CN2. In other words, the TFTelements, the signal lines, and the scan lines are formed in differentlayers.

In the first embodiment, as illustrated in FIG. 7, the light-shieldingfilm BM is disposed in a shape that includes the signal lines SL(k) toSL(k+3) and the scan line GL(m). It is for a reason to suppressreflection caused by the wiring layers of the signal lines SL(k) toSL(k+3) and the scan line GL(m). The shape of the light-shielding filmBM in this case normally maximizes an aperture ratio with minimallyrequired dimensions for preventing the reflection, and particularly, theaperture ratio of the green pixels having a high visibility is oftenmaximized. Also in the first embodiment, the shape of thelight-shielding film BM maximizes the aperture ratio of the green pixel.The larger the openings OP(R), OP(G), and OP(B), the larger the apertureratios. In FIG. 7, the opening OP(G) is enlarged to maximize theaperture ratio of the green pixel. At this green pixel, a width L1 ofthe light-shielding film BM along the scan line GL(m) is made small.

Meanwhile, in order to optimize white balance, a method in which a widthof the light-shielding film BM is made larger at the red pixels and theblue pixels than that at the green pixels to reduce the aperture ratiosis used in some cases. Also in the first embodiment, at the red pixel orthe blue pixel or at both of the pixels, the width of thelight-shielding film BM is made larger than that at the green pixel toreduce the aperture ratio. In FIG. 7, at the red pixel on the left, awidth L2 of the light-shielding film BM along the scan line GL(m) ismade large.

It is required to dispose the spacer SP for retaining a gap between thefirst substrate TGB and the second substrate CGB. However, liquidcrystal orientations are easily disturbed in the periphery thereof.Since it is required to shield the periphery thereof from light, thewidth of the light-shielding film BM is made larger, in some cases. Alsoin the first embodiment, the width of the light-shielding film BM ismade larger at the pixels in the periphery of the spacer SP. In FIG. 7,at the red pixel and the blue pixel on the right, a width L3 of thelight-shielding film BM along the scan line GL(m) is made large.

FIG. 16 is a plan view illustrating another example of the arrangementrelation between the metal electrode opposed to the drive electrode andthe light-shielding film according to the first embodiment. FIG. 16illustrates the arrangement relation between the metal electrode and thelight-shielding film in a case where the metal electrode ML is arrangedalso on a side of the scan line GL(m+1). As illustrated in FIG. 16, ashape of the light-shielding film BM on the side of the scan lineGL(m+1) is the same as that on a side of the scan line GL(m). That is,on the side of the scan line GL(m+1), the light-shielding film BM ateach of the red pixel on the left, the blue pixel, and the red pixel onthe right is formed in a region closer to the side of the scan lineGL(m) than the light-shielding film BM at the green pixel. Accordingly,also on the side of the scan line GL(m+1), a width of thelight-shielding film BM at each of the red pixel on the left, the bluepixel, and the red pixel on the right is made larger than a width of thelight-shielding film BM at the green pixel. In addition, the metalelectrode ML on the side of the scan line GL(m+1) is also formed so asto overlap with the light-shielding film BM in plan view. As illustratedin FIG. 16, a width of the metal electrode ML at each of the red pixelon the left, the blue pixel, and the red pixel on the right where thewidth of the light-shielding film BM is large is larger than a width ofthe metal electrode ML at the green pixel. Note that the metal electrodeML on the side of the scan line GL(m+1) may not necessarily be arranged.In the first embodiment, at the location including a portion of thelight-shielding film BM with a large width as described above, asillustrated in FIG. 7 and FIG. 16, a width of the wiring pattern of themetal electrode ML is also formed to be large. In FIG. 7, regarding thewidth of the light-shielding film BM along the scan line GL(m), thewidth L1 at the green pixel is the smallest, the width L2 at the redpixel on the left is made larger compared with that, and the width L3 atthe red pixel and the blue pixel on the right is made much larger.Corresponding to this, regarding the width of the wiring pattern of themetal electrode ML, a width L11 at the green pixel is the smallest, awidth L12 at the red pixel on the left is made larger compared withthat, and a width L13 at the red pixel and the blue pixel on the rightis made much larger. The width of the light-shielding film BM and thewidth of the wiring pattern of the metal electrode ML are the dimensionsin the direction intersecting with the direction in which the scan lineGL(m) extends.

In this manner, in the first embodiment, in plan view, the width of thewiring pattern of the metal electrode ML overlapped with the portion ofthe light-shielding film BM with the large width is larger than a widthof the wiring pattern of the metal electrode ML overlapped with portionsother than the portion of the light-shielding film BM with the largewidth. Specifically, the spacer SP is overlapped with the portion of thelight-shielding film BM with the large width, and the width of thewiring pattern of the metal electrode ML overlapped with the spacer SPis larger than the width of the wiring pattern of the metal electrode MLnot overlapped with the spacer SP. Also, the red pixel, the blue pixel,or both of the pixels are overlapped with the portion of thelight-shielding film BM with the large width, and the width of thewiring pattern of the metal electrode ML overlapped with the red pixel,the blue pixel, or both of the pixels is larger than the width of thewiring pattern of the metal electrode ML not overlapped with the redpixel, the blue pixel, or both of the pixels. Therefore, in the presentembodiment, the metal electrode ML has a step shape corresponding to theshape of the light-shielding film BM as illustrated in FIG. 7 and FIG.16, instead of the simple linear shape like that of the comparativeexample illustrated in FIG. 9.

Therefore, according to the first embodiment, without reducing theaperture ratios, the total resistance value can be reduced more than thecase in which the metal electrode is formed in the linear shape. Morespecifically, the resistance of the drive electrode can be reduced bythe arrangement relation between the metal electrode ML and thelight-shielding film BM. As a result, by applying this to a touch panelof the electromagnetic induction method, the time constant of the driveelectrode can be reduced, and touch performance can be improved.Furthermore, even when this is applied to a touch panel which carriesout detection by both of the methods, i.e., the electromagneticinduction method and the capacitive sensing method, touch performancewith high accuracy can be obtained.

In the first embodiment, as illustrated in FIG. 8, the metal electrodeML is formed in a layer different from a layer in which the driveelectrode TL(n) is formed. More specifically, the metal electrode ML isformed in an upper layer of the layer in which the drive electrode TL(n)is formed. The metal electrode ML and the drive electrode TL(n) areelectrically connected to each other so as to make ohmic contact in asurface contact manner.

In the first embodiment, the electric connection between the metalelectrode ML and the drive electrode TL(n) is not limited to the case inwhich they are in ohmic contact in a surface contact manner. Forexample, the metal electrode ML may be formed on the drive electrodeTL(n) via an insulating layer, and the metal electrode ML and the driveelectrode TL(n) may be electrically connected to each other through anopening of the insulating layer. In such a case, the metal electrode MLis insulated from the drive electrode TL(n), and the metal electrode MLand the drive electrode TL(n) are electrically connected to each otherthrough the opening.

Second Embodiment

A display device 1 according to a second embodiment will be describedwith reference to FIGS. 10 to 14. In this second embodiment, differencefrom the first embodiment described before will be mainly described. Thesecond embodiment is an example in which the idea of resistancereduction of the drive electrode in the first embodiment is applied alsoto arrangement of the far-end, the intermediate, and the near-end driveelectrodes in the entire display region.

<Operation in Magnetic Field Generation Period>

FIG. 10 is an explanatory plan view illustrating operation during amagnetic field generation period of the display device 1 according tothe second embodiment. In FIGS. 2A to 2C described above, the principlesof the magnetic field touch detection are illustrated by the example inwhich the loop-shaped magnetic field generation coil is formed byserially connecting the ends of the two drive electrodes separatelydisposed. However, in the present second embodiment, in magnetic fieldtouch detection, a plurality of drive electrodes separately disposed areselected at the same time, and drive voltages are supplied thereto suchthat currents flow therethrough in mutually opposite directions.

In FIG. 10, reference characters TL(0) to TL(p) denote drive electrodes.The drive electrodes TL(0) to TL(p) are disposed in parallel to oneanother in plan view, and each of the drive electrodes is provided witha pair of ends n1 and n2.

In FIG. 10, reference characters DRVL and DRVR denote the drive circuitsillustrated in FIG. 4. The drive circuits DRVL and DRVR are providedwith selection circuits SEL(0) to SEL(p) and SER(0) to SER(p),respectively corresponding to the drive electrodes TL(0) to TL(p), andpairs of switches S1L and S2L and pairs of switches S1R and S2R,respectively, corresponding to these selection circuits.

Each of the selection circuits SEL(0) to SEL(p) and SER(0) to SER(p)switches the switches S1L and S2L or S1R and S2R corresponding to eachselection circuit in accordance with a selection signal and selects anyof the corresponding drive electrodes TL(0) to TL(p). Each of theswitches S1L, S2L, S1R, and S2R corresponding to the selection circuitsis caused to be in an on-state by the selection signal from thecorresponding selection circuit.

When each of the switches S1L corresponding to the selection circuitsSEL(0) to SEL(p) is caused to be in the on-state by the selectionsignal, the switch connects the signal wire TPLL with the one end n1 ofany of the corresponding drive electrodes TL(0) to TL(p). When each ofthe switches S2L corresponding to the selection circuits SEL(0) toSEL(p) is caused to be in the on-state by the selection signal, theswitch connects the signal wire TSVL with the one end n1 of any of thecorresponding drive electrodes TL(0) to TL(p).

When each of the switches S1R corresponding to the selection circuitsSER(0) to SER(p) is caused to be in the on-state by the selectionsignal, the switch connects the signal wire TPLR with the other end n2of any of the corresponding drive electrodes TL(0) to TL(p). When eachof the switches S2R corresponding to the selection circuits SER(0) toSER(p) is caused to be in the on-state by the selection signal, theswitch connects the signal wire TSVR with the other end n2 of any of thecorresponding drive electrodes TL(0) to TL(p).

In this second embodiment, the drive signal TPL supplied to the signalwires TPLL and TPLR is DC voltage. The DC voltage drive signal TPL is,for example, a signal of the voltage Vs like a ground voltage. the drivesignal TSV supplied to the signal wires TSVL and TSVR is AC voltage. TheAC voltage drive signal TSV is, for example, a signal which periodicallychanges between the voltage Vs such as the ground voltage and a voltageVd higher than the voltage Vs.

Herein, a case in which a magnetic field is generated in the region ofthe drive electrode TL(4) will be described. In a magnetic fieldgeneration period, a plurality of drive electrodes and a plurality ofother drive electrodes which are disposed to sandwich the region of thedrive electrode at which the magnetic field is generated are selected,and the plurality of drive electrodes and the plurality of other driveelectrodes are driven in such a way that the directions of the currentsflowing through the plurality of drive electrodes and the plurality ofother drive electrodes selected become opposite to each other.

In FIG. 10, the three adjacent drive electrodes are formed into abundle, and a bundle of the drive electrodes (hereinafter, also referredto as a drive electrode bundle) are used as the drive electrodes forminga pair. More specifically, the drive electrodes TL(1) to TL(3) areformed into a bundle to constitute a drive electrode bundle, and thedrive electrodes TL(5) to TL(7) are formed into a bundle to constitute adrive electrode bundle.

In the magnetic field generation period, the three drive electrodesTL(1) to TL(3) and the three drive electrodes TL(5) to TL(7), which aredisposed so as to sandwich the drive electrode TL(4) corresponding tothe region in which the magnetic field is generated, are selected by thecorresponding selection circuits SEL(1) to SEL(3)and SER(1) to SER(3),and the corresponding selection circuits SEL(5) to SEL(7) and SER(5) toSER(7).

The selection circuits SER(1) to SER(3) turn on the switches S2R by theselection signals and connect the selected drive electrodes TL(1) toTL(3) to the signal wire TSVR. Similarly, the selection circuits SEL(1)to SEL(3) turn on the switches S1L by the selection signals and connectthe selected drive electrodes TL(1) to TL(3) to the signal wire TPLL. Atthe selected drive electrodes TL(1) to TL(3), the voltage Vd is suppliedto the other ends n2 from the signal wire TSVR, and the voltage Vs issupplied to the one ends n1 from the signal wire TPLL. In FIG. 10, thevoltage Vd is indicated by +, and the voltage Vs is indicated by 0.

At the same time, the selection circuits SEL(5) to SEL(7) turn on theswitches S2L by the selection signals and connect the selected driveelectrodes TL(5) to TL(7) to the signal wire TSVL. Similarly, theselection circuits SER(5) to SER(7) turn on the switches S1R by theselection signals and connect the selected drive electrodes TL(5) toTL(7) to the signal wire TPLR. At the selected drive electrodes TL(5) toTL(7), the voltage Vd is supplied to the one ends n1 from the signalwire TSVL, and the voltage Vs is supplied to the other ends n2 from thesignal wire TPLR.

As a result, currents I1 indicated by arrows flow in the driveelectrodes TL(1) to TL(3) from the other ends n2 toward the one ends n1thereof because of a voltage difference therebetween, and a magneticfield ϕ1 is generated. At the same time, currents 12 indicated by arrowsflow in the drive electrodes TL(5) to TL(7) from the one ends n1 towardthe other ends n2 thereof because of a voltage difference therebetween,and a magnetic field ϕ2 is generated. The magnetic field ϕ1 generated bythe drive electrodes TL(1) to TL(3) and the magnetic field ϕ2 generatedby the drive electrodes TL(5) to TL(7) are overlapped with each other inthe region of the drive electrode TL(4), and a strong magnetic field canbe generated in the region of the drive electrode TL(4).

In the same manner as in FIGS. 2A to 2C described above, electric chargeis accumulated in the capacitive element of the pen Pen by the magneticfield generated in the magnetic field generation period, and themagnetic field generated by the pen Pen in the magnetic field detectionperiod is detected by the magnetic field detection coil.

<Metal Electrodes Opposed to Far-End and Near-End Drive Electrodes>

FIGS. 11 and 12 are explanatory views illustrating a problem of thedisplay device 1 according to the second embodiment. FIG. 11 is a planview illustrating a configuration of the drive circuits and the far-enddrive electrode, and FIG. 12 is a plan view illustrating a configurationof the drive circuits and the near-end drive electrode.

In FIG. 11 and FIG. 12, reference characters nVL and nVR denoterespective ends of the signal wires TSVL and TSVR, and referencecharacters nLL and nLR denote respective ends of the signal wires TPLLand TPLR. The respective ends nVL, nVR, nLL, and nLR of the signal wiresTSVL, TSVR, TPLL, and TPLR are connected to the control device 3, whichis a supply source of the drive signals. In the magnetic fieldgeneration period, the control device 3 supplies the drive signals TSVhaving the voltage Vd to the end nVL of the signal wire TSVL and the endnVR of the signal wire TSVR and supplies the drive signals TPL havingthe voltage Vs to the end nLL of the signal wire TPLL and the end nLR ofthe signal wire TPLR.

FIG. 11 illustrates the state of the switches S1L, S1R, S2L, and S2R ina case in which a magnetic field is generated in the region of the driveelectrode TL(4), which is close to the side 2-U of the display region 2.In contrast, FIG. 12 illustrates the state of the switches S1L, S1R,S2L, and S2R in a case in which a magnetic field is generated in theregion of the drive electrode TL(p-4), which is close to the side 2-D ofthe display region 2.

In FIG. 11 and FIG. 12, reference character R illustrated on the signalwires TSVL, TSVR, TPLL, and TPLR denotes a resistance componentaccompanying the signal wire thereof as a resistance of a distributionconstant.

As illustrated in FIG. 11, when a magnetic field is generated in theregion of the drive electrode TL(4), the switches S1L and S2R connectedto the respective ends n1 and n2 of each of the drive electrodes TL(1)to TL(3) become the on-state, and the switches S2L and the switches S1Rconnected to the respective ends n1 and n2 of each of the driveelectrodes TL(5) to TL(7) become the on-state. As a result, currents I1Fin the direction illustrated in the drive electrode TL(2) as an exampleflow in the drive electrodes TL(1) to TL(3), and currents I2F in thedirection illustrated in the drive electrode TL(6) as an example flow inthe drive electrodes TL(5) to TL(7), whereby the magnetic field isgenerated in the region of the drive electrode TL(4).

Similarly, as illustrated in FIG. 12, when a magnetic field is generatedin the region of the drive electrode TL(p-4), the switches S1L and S2Rconnected to the respective ends n1 and n2 of the drive electrodesTL(p-7) to TL(p-5) become the on-state, and the switches S2L and S1Rconnected to the respective ends n1 and n2 of the drive electrodesTL(p-3) to TL(p-1) become the on-state. As a result, currents I1N in thedirection illustrated in the drive electrode TL(p-6) as an example flowin the drive electrodes TL(p-7) to TL(p-5), and currents I2N in thedirection illustrated in the drive electrode TL(p-2) as an example flowin the drive electrodes TL(p-3) to TL(p-1), whereby the magnetic fieldis generated in the region of the drive electrode TL(p-4).

In the case in which the magnetic field is generated in the region ofthe drive electrode TL(p-4), since the drive electrodes TL(p-7) toTL(p-5) and TL(p-3) to TL(p-1) are, in plan view, close to therespective ends nLL and nLR of the signal wires TPLL and TPLR to whichthe drive signals TPL are supplied and close to the respective ends nVLand nVR of the signal wires TSVL and TSVR to which the drive signals TSVare supplied, the resistances R connected between the respective ends n1of these drive electrodes and the ends of the signal wires and betweenthe respective ends n2 of these drive electrodes and the ends of thesignal wires become low. Therefore, in FIG. 12, in the magnetic fieldgeneration period, the currents having an approximately same value asthe currents flowing through the ends nLL, nLR, nVL, and nVR flow inthese drive electrodes as the currents I1N and I2N.

In contrast, in the case in which the magnetic field is generated in theregion of the drive electrode TL(4), since the drive electrodes TL(1) toTL(3) and TL(5) to TL(7) are distant from the ends nLL, nLR, nVL, andnVR of the signal wires in plan view, the resistances R connectedbetween the respective ends n1 of the drive electrodes and the ends ofthe signal wires and between the respective ends n2 of the driveelectrodes and the ends of the signal wires are increased. Therefore, inFIG. 11, in the magnetic field generation period, the currents havingsmaller values compared with FIG. 12 flow in these drive electrodes asthe currents I1F and I2F.

Since the values of the currents which flow through the drive electrodesTL(1) to TL(3) and TL(5) to TL(7) are smaller than the values of thecurrents which flow through the drive electrodes TL(p-7) to TL(p-5) andTL(p-3) to TL(p-1), the magnetic fields generated by the driveelectrodes TL(1) to TL(3) and TL(5) to TL(7) become weaker than themagnetic fields generated by the drive electrodes TL(p-7) to TL(p-5) andTL(p-3) to TL(p-1). As a result, the magnetic field generated in theregion of the drive electrode TL(4) becomes weaker than the magneticfield generated in the region of the drive electrode TL(p-4). Morespecifically, the magnetic field generated by the drive electrodes whichare disposed at the positions distant from the ends nLL, nLR, nVL, andnVR in plan view becomes weaker than the magnetic field generated by thedrive electrodes which are disposed at the positions close to the endsnLL, nLR, nVL, and nVR.

FIG. 13 is a characteristic diagram illustrating values of currentsflowing through drive electrodes in each magnetic field generationperiod of FIG. 11 and FIG. 12. FIG. 13 is a characteristic diagrammeasured and created by the present inventors. In FIG. 13, a horizontalaxis represents the positions of the drive electrodes, a near endillustrates the drive electrode TL(p) disposed to be close to the endsnLL, nLR, nVL, and nVR to which the drive signals TPL and TSV aresupplied, and a far end illustrates the drive electrode TL(0) disposedto be distant from the ends nLL, nLR, nVL, and nVR. The drive electrodesTL(p) to TL(0) are disposed in a direction away from the ends of thesignal wire in this order. A vertical axis of FIG. 13 represents thevalues of the currents flowing through the drive electrodes. As isunderstood from FIG. 13, in the magnetic field generation period, thevalues of the currents which flow through the drive electrodes aresmaller from the near end toward the far end. According to the resultsmeasured by the present inventors, the value of the current flowingthrough the drive electrode at the near end is about three times thevalue of the current flowing through the drive electrode at the far end.

When the values of the currents flowing through the drive electrodes aresmaller from the near end toward the far end, the generated magneticfields are also weakened from the near end toward the far end.Therefore, in the magnetic field generation period, the charge quantityaccumulated in the capacitive element of the pen Pen is also differentdepending on the touched position. As a result, in the magnetic fielddetection period, the amount of change detected by the magnetic fielddetection coil is also changed, and the detection sensitivity is varieddepending on the position. For example, it is conceivable to reduce thevariations in the detection sensitivity and equalize them with respectto the positions by adjusting the received detection signals Rx(0) toRx(p) by the touch control device 5 illustrated in FIG. 4. However, whenthe currents flowing through the drive electrodes are different fromeach other by three times as illustrated in FIG. 13, changes of thegenerated magnetic field are large, and it is not easy to carry outadjustment so as to equalize the detection sensitivity.

Therefore, in the second embodiment, the widths of the metal electrodesopposed to the drive electrodes have different widths at the far end andthe near end. FIG. 14 is an explanatory diagram illustrating the widthsof the metal electrodes opposed to the far-end, the intermediate, andthe near-end drive electrodes of the display device 1 according to thesecond embodiment.

In FIG. 14, reference characters Pix(0) to Pix(3), Pix(n) to Pix(n+3),and Pix(p-3) to Pix(p) denote the rows of the pixel array in which theplurality of pixels are disposed in the matrix, and reference charactersPix(0) to Pix(3) denote the far end, reference characters Pix(n) toPix(n+3) are the intermediate, and reference characters Pix(p-3) toPix(p) denote the near end. “Pix(0)” is the farthest, and “Pix(p) is thenearest. Reference characters R, G, and B denote that they correspond tothe sub-pixels SPix of red, green, and blue, respectively. The pixelsPix of each row in the matrix are repeatedly disposed such that thethree sub-pixels SPix of red, green, and blue correspond to one set ofthe pixel.

In FIG. 14, regarding the metal electrode ML opposed to each of thefar-end drive electrodes, the intermediate drive electrodes, and thenear-end drive electrodes, a portion (L41) where the width of the metalelectrode ML is made large and a portion (L42) where the width of themetal electrode ML is made small are illustrated. The large portion(L41) is illustrated by two stacked rectangles, and the small portion(L42) is illustrated by a single rectangle.

For example, in the pixel array Pix(0) to Pix(3) at the far end, thewidths of the metal electrodes ML corresponding to the pixels of red (R)and green (G) on the left end are formed to be small, the widths of themetal electrodes ML corresponding to the pixels of blue (B), red (R),green (G), and blue (B) adjacent thereto are formed to be large, thewidths of the metal electrodes ML corresponding to the pixels of red (R)and green (G) adjacent thereto are formed to be small, and the width ofthe metal electrode ML corresponding to the pixel of blue (B) on theright end is formed to be large. In contrast, in the pixel arrayPix(p-3) to Pix(p) at the near end, the widths of all the metalelectrodes ML corresponding to the pixels of red (R), green (G), andblue (B) are formed to be small. Also, in the intermediate pixel arrayPix(n) to Pix(n+3), the metal electrodes ML having the widthscorresponding to the far end and the near end are formed alternatelyevery other row.

In this manner, in the second embodiment, in plan view, the portion ofthe wiring pattern of the metal electrode ML whose width is large andopposed to the drive electrodes (corresponding to the pixel arrayPix(p-3) to Pix(p)) positioned at the near end (first end) is gettingsmaller than the portion of the wiring pattern of the metal electrode MLwhose width is large and opposed to the drive electrodes positioned(corresponding to the pixel array Pix(0) to Pix(3))at the far end(second end), as the metal electrode is closer to the near end. Byvirtue of this, the closer to the near end from the far end the metalelectrode is, the more the portion of the metal electrode ML whose widthis large is reduced; as a result, in-plane difference in resistancebetween the drive electrodes can be suppressed. Since the densitydifference between the metal electrodes ML at the far end and the nearend is not so large, line width variation due to etching variation canbe also suppressed.

In the example of FIG. 14, two types, i.e., the portion (L41) of themetal electrode ML whose width is made large and the portion (L42) ofthe metal electrode ML whose width is made small are provided; however,the types can be broken down into three types or more. Regarding thewidths of the far-end, the intermediate, and the near-end metalelectrodes ML, it is desired that the widths of the metal electrodes MLbe determined in consideration of the case in which the region where thewidth of the light-shielding film BM is large is small, such as a casein which disposition density of the spacers SP (FIG. 7) is low.

<Electronic Device>

FIG. 15 is a perspective view illustrating a configuration of anelectronic device 100 with which the display device 1 described in thefirst and the second embodiments is provided. The electronic device 100is provided with a tablet-type computer 101, which is provided with thedisplay device 1, and the pen Pen. The pen Pen is an indicator includingthe coil and the capacitive element as illustrated in FIGS. 2A to 2C. InFIG. 15, reference numeral 2 denotes the above described display region,and reference numeral 102 denotes the frame region disposed so as tosurround the display region 2. Also, reference numeral 103 denotes abutton of the computer 101.

An image is displayed in the display region 2 in the above describeddisplay period. Also, in the magnetic field touch detection period,etc., whether the pen Pen is in proximity to the display region 2 or notand the coordinates thereof are detected, and the computer 101 carriesout processing in accordance with the result of this detection.

The pen Pen and the tablet-type computer 101 may not be required to beelectrically directly connected to each other. The electronic device 100is not required to include the pen Pen, and, in that case, thetablet-type computer 101 itself corresponds to the electronic device100. As a display device included in the electronic device 100, alaptop-type or a desktop-type personal computer can be used instead ofthe tablet-type computer.

Various modifications and alterations can be conceived by those skilledin the art within the spirit of the present invention, and it isunderstood that such modifications and alterations are also encompassedwithin the scope of the present invention.

For example, those skilled in the art can suitably modify theabove-described embodiment by addition, deletion, or design change ofcomponents, or by addition, omission, or condition change of steps. Suchmodifications are also encompassed within the scope of the presentinvention as long as they include the gist of the present invention.

For example, in the above described embodiments, the case in which thedrive electrodes TL(0) to TL(p) extend in the row direction (lateraldirection) and are disposed in parallel in the column direction(longitudinal direction) has been described. However, the row directionand the column direction are changed depending on a viewpoint. A case inwhich, with a different viewpoint, the drive electrodes TL(0) to TL(p)extend in the column direction and are disposed in parallel in the rowdirection is also included in the scope of the present invention. Also,“parallel” used in the present specification means that they extendwithout intersecting with each other from one end to the other end.Therefore, even if a part or all of one line (or electrode) is providedin a tilted state with respect to the other line (or electrode), as longas these lines do not intersect with each other from one end to theother end, this state is also “parallel” in the present specification.

What is claimed is:
 1. An input detection device comprising: a pluralityof drive electrodes; a metal electrode opposed to the plurality of driveelectrodes and having a predetermined wiring pattern; and alight-shielding film, the light-shielding film having a portion of thelarge width the width of which is larger than other portions, wherein,in plan view, a width of the wiring pattern overlapped with the portionof the large width is larger than a width of the wiring patternoverlapped with portions other than the portion of the large width. 2.The input detection device according to claim 1, wherein the metalelectrode is formed in a layer different from a layer in which the driveelectrodes are formed.
 3. The input detection device according to claim1, wherein the metal electrode is electrically connected to the driveelectrodes.
 4. The input detection device according to claim 1, whereinthe metal electrode is insulated from the drive electrodes.
 5. The inputdetection device according to claim 1, further comprising: a spacerretaining a gap between a first substrate and a second substrate,wherein, in plan view, the spacer is overlapped with the portion of thelarge width, and the width of the wiring pattern overlapped with thespacer is larger than the width of the wiring pattern not overlappedwith the spacer.
 6. The input detection device according to claim 1,further comprising: a pixel array having a plurality of pixels of a redpixel, a green pixel, and a blue pixel disposed in a row-columnconfiguration, wherein, in plan view, the red pixel, the blue pixel, orboth the red and the blue pixels are overlapped with the portion of thelarge width, and the width of the wiring pattern overlapped with the redpixel, the blue pixel, or both the red and the blue pixels is largerthan the width of the wiring pattern not overlapped with the red pixel,the blue pixel, or both the red and blue pixels.
 7. The input detectiondevice according to claim 1, further comprising: a supply source of adrive voltage; and a signal wire supplying the drive voltage to theplurality of drive electrodes, wherein, in plan view, the plurality ofdrive electrodes extend in a first direction and are arrayed in a seconddirection intersecting with the first direction, the signal wire extendsin the second direction, the signal wire including a first end close tothe supply source and a second end farther from the supply source thanthe first end, and regarding the amount of the portion of the wiringpattern the width of which is large, the metal electrode positioned atthe first end is smaller than the metal electrode positioned at thesecond end, as the metal electrode is closer to the first end.
 8. Theinput detection device according to claim 1, wherein the plurality ofdrive electrodes are drive electrodes performing input detection of anelectromagnetic induction method.
 9. An electronic device comprising:the input detection device according to claim 1.